1. 用不同接方法,对坯料不同工艺处理,接成形时出现缝开裂,对其坯料母材及开裂显微分析。
To do mycology analysis to the blank parent and its cracking weld for different procedure treatment to the blank before welding and occur weld crack during welding forming by different welding method.

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2. 就轧辊喷的技术关键问题:变形控制,涂层均匀性的控制,喷后辊子外径尺寸控制及轧辊的组工艺等,以介绍。
The paper introduces the difficulties of roller spray welding technique such as controlling for distortion, keeping for layer evenness and dimension of roller diameter.

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3. 利用化学镀镍阻挡层,化学镀金层,可得到良好的接效果。
Good soldering result may be obtained by applying electroless nickel as barrier layer and electroless gold as top layer to provide solderability.

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4. 表面贴装印制板设计直接影响接质量,将专门针对表面贴装印制板的盘设计、布线设计、定位设计、过孔处理等实用技术一些探讨。
Design of surface mount PCB makes an impact on soldering quality. The design of soldering pad, track layout, location and through hole treatment are discussed.

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5. 本文着重从接夹具方面对侧围总成装拼台的设计介绍。
This paper introduces the design of the bench of the assembling and welding of the lateral assembly with focus on welding jig.

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6. 本文着重从接夹具方面对侧围总成装拼台的设计介绍。
This paper introduces the design of the bench of the assembling and welding of the lateral assembly with focus on welding jig.

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