We introduced three kinds of thick film resistor (TFR) conductive model.
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2. 厚膜陶瓷基质的氧化镉中所含的镉。
Cadmium contained in the cadmium oxide of a thick film ceramic substrate.
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3. 生产厚膜混合电路和传导加热器。
Midas Microelectronics Corp. Produces thick film hybrid circuits and conduction heaters.
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4. 同时，铝浆厚膜烧结层又作为背面电极。
Simultaneously, the SP aluminum thick film layer is the rear electrode.
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5. 但是，厚膜电阻器的噪声大是不争的事实。
However high thick film resistance noise is undisputed fact.
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6. 集成电路有厚膜集成电路和薄膜集成电路。
The integrated circuit contain thick film integrated circuit and the thin film integrated circuits.
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7. 介绍镍浆料和厚膜湿敏电阻器的制备工艺。
The preparation technology of nickel paste and thick-film humidity sensitive resistor is introduced.
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8. 因此铜是制备金刚石厚膜的理想基体材料。
These indicate that copper is an ideal substrate for the preparation of thick diamond films.
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9. 研究了厚膜电阻浆料用有机载体的挥发特性。
The volatility of the organic carrier in thick film resistance paste was studied.
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10. 良好的耐热性和耐候性是确保了使用金属釉厚膜。
Excellent heat resistance and weather resistance are ensured by the use of metal glaze thick film.
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11. 镉氧化物在厚膜金浆料中可以起到很好的粘附作用。
It is well documented that cadmium oxide is an excellent adhesion promoter in thick film gold paste.
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12. 音频放大，视频处理，电源管理混合厚膜集成电路。
Audio frequency enlarge, video deal with, power manage and mix the thick membrane integrated circuit.
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13. 介绍了应用于微波和RF电路中的厚膜材料和工艺。
Thick film material and process applied in microwave and RF circuits are offered in the paper.
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14. 在铍氧化物基体上使用的厚膜胶中的镉和镉的氧化物。
Cadmium and cadmium oxide in thick film pastes used on beryllium oxide substrates.
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15. 用氧化铍连接铝制成的厚膜浆料中镉和氧化镉的含量。
Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.
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16. 丝网印刷与厚膜ic技术是微电子技术的核心技术之一。
Screen printing and thick film IC technology are the core of microelectronics.
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17. 厚膜铂电阻是以铂膜作电阻，采用丝网印刷工艺制造的。
Using screen printing technology thick film platinum resistor are made of platinum film as resistor.
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18. 但在金刚石厚膜钎焊刀具的加工过程中，还存在许多问题。
But there are many problems in the process of making brazing diamond film tools.
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19. 利用SIMOX技术和硅外延工艺制备了厚膜SOI材料。
The thick SOI films were prepared by SIMOX technology and Si epitaxy process.
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20. 到目前，贺利氏已经开发并且打入一些环保型厚膜产品市场。
To date, Heraeus has developed and introduced into the market many environmentally friendly thick film products.
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21. 对用厚膜烧成法在PTCR半导瓷上制备镍电极进行了研究。
Preparing the nickel electrode on PTCR semiconductive ceramics by thick-film firing method were researched.
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22. 研究了基于流延技术制备硅基锆钛酸铅(PZT)厚膜的工艺。
A silicon based lead zirconate titanate (PZT) thick film technology by tape casting is studied in this paper.
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23. 介绍了一种用于高品质射频集成电感的厚膜多孔硅背向生长技术。
A backside growth technique of thick porous silicon layers for the on-chip RF integrated inductor is presented.
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24. 用氧化铍连接铝制成的厚膜浆料中镉和氧化镉的替代物仍然不切实际。
The substitution of cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide is currently not practicable.
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25. 概述了应用高功能厚膜印刷技术形成双面，多层电路和嵌入无源元件。
This paper describes the formation of double side and multilayer circuit, and embedded passive component using high function thick film printing technology.
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26. 对这三种厚膜传感器的本征电阻及对乙醇蒸汽的敏感特性进行了测试。
The intrinsic resistances and gas sensing performance of the samples to ethanol vapor were tested.
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27. 论述了无需直流辅助电源、用厚膜电路构成的静态型电流和电压继电器。
The static current and voltage relays made of solid state circuit and without DC auxiliary supply are presented.
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28. 陶瓷基板的表面张力和厚膜浆料对基板的润湿度会影响印刷线条的分辨率。
The influence of surface energies of ceramic substrates an line resolution in screen printing was studied in this article.
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29. 陶瓷基板的表面张力和厚膜浆料对基板的润湿度会影响印刷线条的分辨率。
The influence of surface energies of ceramic substrates an line resolution in screen printing was studied in this article.
